|
| Capability |
|
Item |
Parameter |
Remark |
| Layers |
1-32L |
|
| Material Type |
CEM-1,CEM-3,FR4, High Tg FR4,Halogen Free,Aluminum board |
|
| Max Panel size |
20"X24"(508mmX622mm) |
|
| Outline Tolerance |
±4mil(±0.1mm) |
|
| Board thickness |
15.7mil--126mil(0.4mm--3.2mm) |
|
| Min width/space |
4mil/4mil(0.1mm/0.1mm) |
|
| internal copper |
1/2oz--4oz |
|
| external copper |
1/2oz--6oz |
|
| Layer to layer registration |
±4mil(±0.1mm) |
|
| copper for wall of hole |
15-35um |
|
| etch tolerance |
±20% |
|
| Min drilling diameter |
0.2mm |
|
| tolerance of drilling |
PTH ±3mil(±0.075mm)，NPTH±2mil(±0.05mm) |
|
| hole precision |
±3mil(±0.075mm) |
|
| Aspect Ratio |
10:1 |
|
| soldermask |
LPI soldermask(Green/Red/Yellow/Black/White/Blue/Matt Green/Matt Black) |
|
| Surface treatment |
HASL, HAL LF, ENIG, Immersion Tin, Immersion Silver,OSP,ENEPIG,Gold finger |
|
| tolerance of impedance |
±5%(<50Ω),Others +/-10% |
|
| warp and twist |
0.75% |
|
|
|
|
